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| Conn_01x04 | Pin header, 2.54 mm, 1x10 Pin header, 2.54 mm, 1x2 (see [build notes](build.md | | | | D 2 rotary switch with Signal Lamp, generic K switch triple-pole double-throw DPDT spdt ON-ON illuminated red green D Push button switch OFF-(ON) | Dailywell | PAS7B3M1CESA6-5 | Tayda | A-157 | | | | Screws, nuts, and spacers (see [build notes](build.md)) | | | R8, R10, R12 | 3 | A1M | Potentiometer | | | S3 | 1 | 10 uF | Polarized capacitor | | | U2 | 1 | Synth_power_2x5 | 2x5 pin shrouded header 2.54 mm spacing | | | | C2 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-8/SOIC-8/TSSOP-8/VSSOP-8 Low-Power, Quad-Operational Amplifiers, DIP-14/SOIC-14/SSOP-14 Dual Operational Amplifiers, DIP-8/SOIC-8/TSSOP-8/VSSOP-8 Audio Jack, 2 Poles (Mono / TS), Switched T Pole (Normalling) | | 14 pin DIP socket | | J1 | 1 | 1 | SW_SPDT | SPDT miniature toggle switch ON-ON Push button switch, normally open, two pins, 45° tilted D Momentary Switch, dual pole double throw, center OFF position K switch normally-open pushbutton push-button D Push button switch, normally closed, generic, four pins D Push button switch Off-On CuK sub miniature slide switch, EG series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.039x3.951mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x20, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT.

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