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BackDfn udfn dual flat OnSemi VCT, 28 Pin (package code T2844-1; https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source.
- LongPads 18-lead though-hole mounted DIP package, row spacing.
- -0.0815518 0.993283 vertex -5.59201 -4.18951 7.89187.