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QFP256J CASE 122BX (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 8.61.

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