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Rectangle square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_6_3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin, exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-770967-x, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-LC, 19 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a 5mm led, with a hair of margin // margins from edges h_margin = hole_dist_side + thickness; v_margin = hole_dist_top*2 + thickness; working_height = height * rotate_vector_cos, rotate_vector_sin * height], // top right [left_edge + height * rotate_vector_cos, ]; polygon(points = points); master PSU/Synth Mages Power Word Stun.kicad_pro | 85 cd18ed43dc Added hard sync to schematic, laid out PCB with exploratory 8hp layout Bring in diylc and openscad design Panels/dual_vca.scad | 393 create mode 100644 Synth_Manuals/Module Summaries.ods pushed tag v1 to synth_mages/MK_SEQ released Prototype Version 1.0 at synth_mages/MK_SEQ pushed tag v1.0 to synth_mages/precadsr

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