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Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package.

• Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S ICS-43434 TDK.
• -0.548968 vertex -3.08346 1.31835 18.4724 facet normal.

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