Labels Milestones
Back1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x08 2.54mm single row Through hole straight pin header, 2x26, 2.00mm pitch, double rows Surface mounted pin header SMD 1x03 1.27mm single row Through hole angled pin header SMD 2x26 1.00mm double row surface-mounted straight pin header, 2x13, 1.27mm pitch, single row Through hole socket strip SMD 1x36 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x26 2.54mm single row Through hole angled socket strip, 2x04, 1.27mm pitch, single row Surface mounted socket strip SMD 2x08 2.00mm double row Through hole angled socket strip SMD 1x17 1.00mm single row style1 pin1 left Surface mounted socket strip.
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