Labels Milestones

Back

Ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 460, 2.3x2.48mm.

• 5.74921 vertex 8.17421 1.62595.
• Normal -5.035382e-001 -1.131508e-003 8.639722e-001 vertex.
• | 580 .../precadsr_aux_Gerbers/precadsr-F_Mask.gbr | 185 .../precadsr_aux_Gerbers/precadsr-B_Paste.gbr | 4.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects