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4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole.

• 43160-2104, With thermal vias in pads.
• 1.006749e+02 1.197185e+01 facet normal 5.628345e-001.
• Normal -0.0127267 0.705404 0.708692 vertex -0.781299.

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