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HLE-117-02-xxx-DV, 17 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Tantalum Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081595_0_lqfn16.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xxx-DV-A, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xxx-DV-BE, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x36 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x12 2.54mm single row Through hole socket strip THT 2x23 2.00mm double row surface-mounted straight socket strip, 1x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x33 2.54mm single row Surface mounted socket strip THT 2x21 2.54mm double row Through hole vertical IDC box header, 2x13, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x07 1.00mm double row surface-mounted straight socket strip, 2x28, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip THT 2x12 1.00mm double row surface-mounted straight pin header, 1x34, 1.00mm pitch, double rows Through hole angled pin header, 1x38, 2.54mm pitch, double rows Through hole IDC header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 1x29 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x18 2.00mm double row Through hole angled socket strip, 2x33, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header, 2x30, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted pin header SMD 1x21 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x16 1.00mm single row Surface mounted pin header SMD 2x22 1.00mm double row Through hole angled pin header THT.

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