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BackLTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pro Normal file View File 3D Printing/Jigs/eurorack_jig_v2.stl Executable file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Switch_Hole.kicad_mod Normal file View File 3D Printing/Pot_Knobs/Guitar_Amp_Knob-2_ring_bell.stl Executable file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-03A_1x03_P2.54mm_Vertical.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIN5.kicad_mod delete mode 100644 Hardware/Panel/precadsr-panel/sym-lib-table create mode.
- -0.188007 -0.291191 0.938009 facet normal.
- Power chip flatwire 1:1, Power Inductor, Wuerth.
- Published, Contributor may Distribute the Program.
- CC8V-T1A/CM8V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package SMD.