synth_tools

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Ideas left_rib_x = thickness + 6 + tolerance; extra_depth = 75 + tolerance; rotate_vector_cos = 0.94; // 'x' of 20 degree rotation rotate_vector_sin = 0.34; // 'y' of rotation left_edge = -rotate_vector_sin * rail_depth; right_edge = height - v_margin - title_font; saw_out = [output_column, row_2, 0]; fm_lvl = [second_col, fifth_row, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_3, 0]; c_tune = [width_mm/2, top_row, 0]; scale([.38,.38,-.005]) surface("FireballSpellVertSmaller.png", center=true, invert=false); text(string, size, halign=halign, font=font); } module title(string, size=12, halign="center", font=font_for_title) { color([1,0,0]) linear_extrude(height) text(string, size, halign=halign); } .. Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-BE-LC, 28 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 2 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.7mm, size.

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