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Snapin 122002H 122002L 12B0A4S 12B0A1V Potentiometer, horizontal, Piher PT-10-H01, http://www.piher-nacesa.com/pdf/12-PT10v03.pdf Potentiometer horizontal ACP CA9-H5 Potentiometer, vertical, Alps RK09K Single, https://tech.alpsalpine.com/prod/e/pdf/potentiometer/rotarypotentiometers/rk09k/rk09k.pdf Potentiometer horizontal Bourns 3296P Potentiometer, vertical, Piher PT-10-V10, http://www.piher-nacesa.com/pdf/12-PT10v03.pdf Potentiometer vertical hole ACP CA14-VSMD Potentiometer, vertical, Bourns PRS11S, http://www.bourns.com/docs/Product-Datasheets/PRS11S.pdf Potentiometer vertical Piher PC-16 Single Potentiometer, horizontal, Bourns 3269P, https://www.bourns.com/docs/Product-Datasheets/3269.pdf Potentiometer horizontal Bourns 3005 Potentiometer, horizontal, Piher PT-10-H05, http://www.piher-nacesa.com/pdf/12-PT10v03.pdf Potentiometer vertical Vishay T73YP Abracon RHCP ceramic patch antenna 854-882Mhz, 5dBi Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, -0.5dBi, https://www.johansontechnology.com/datasheets/2450AT18A100/2450AT18A100.pdf Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, 1dBi, https://www.johansontechnology.com/datasheets/2450AT43F0100/2450AT43F0100.pdf Pulse RF Antenna, 4mm Clearance 6-pin 1.6x0.8 mm balun footprint Johanson 0900PC15J0013 DFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-BE-A, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0020, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, With thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (JEDEC MO-153 Var GA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat No Lead Package (MF) - 6x5 mm Body [QFN]; (see Microchip Packaging.

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