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Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix.

9.507449e+01 2.655000e+01 facet normal 0.016946.
(https://katalog.we-online.de/em/datasheet/9774025951.pdf), generated with kicad-footprint-generator.
-0.301372 -0.0723665 0.950757 facet.

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