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BackLFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header SMD 1x33 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x20 2.00mm double row Through hole socket strip THT 1x03 1.27mm single row Through hole angled pin header THT 1x25 2.54mm single row Through hole pin header SMD 2x04 1.27mm double row surface-mounted straight pin header, 2x37, 2.54mm pitch, 6mm pin length, single row Surface mounted socket strip THT 2x22 1.27mm double row surface-mounted straight socket strip, 2x18, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x31 1.00mm double row surface-mounted straight socket strip, 1x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x16, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x15 2.54mm double row surface-mounted straight.
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