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BackLFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (JEDEC MO-153 Var JC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100.
- License here: http://creativecommons.org/licenses/by-nc-sa/3.0/ version history --------------- 1.1 2012-04-12.
- -7.28862 7.09583 facet normal 0.767816 -0.634378 0.0895789.
- 6.35mm, hole diameter 0.9mm.