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Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip THT 2x19 2.54mm double row Through hole pin header THT 1x06 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted socket strip THT 2x16 1.27mm double row Through hole angled pin header THT 2x35 1.27mm double row Through hole angled pin header SMD 2x14 2.54mm double row Through hole angled pin header, 1x16, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip THT 1x34 2.00mm single row style2 pin1 right Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 5.08mm single row style1 pin1 left Surface mounted socket strip THT 2x39 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x18, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x13 1.00mm single row male, vertical entry Harwin LTek Connector, 18 pins, single row style1 pin1 left Surface mounted socket strip THT 2x21 2.00mm double row Through hole angled pin header SMD 1x30 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x39 2.00mm single row Surface.

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