Labels Milestones
BackWidth 5.3 mm; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 2.54mm TO-247-5, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-9 Horizontal RM 2.54mm TO-247-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9, Vertical, RM 2.54mm, staggered type-2 TO-220-9, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-11, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.
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