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Pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 5.6, Wuerth electronics 9774080951 (https://katalog.we-online.de/em/datasheet/9774080951.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-0210, 2 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator connector JST EH series connector, 14110713002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator JST PUD series connector, S2B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM05B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0412-6-51, 12 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-15A, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, AFC07-S24FCA-00, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins diameter 3.0mm z-position of LED center 3.0mm 2 pins LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm, 2 pins, diameter 3.0mm 2 pins LED, diameter 10.0mm, 2 pins, single row Through hole straight socket strip, 2x38, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x06, 2.54mm pitch, double rows Through hole socket strip THT 2x29 1.27mm double row Through hole straight socket strip, 1x05, 2.54mm pitch, 8.51mm socket length, double rows Through hole IDC header, 2x10, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x11 1.00mm single row Through hole pin header THT 2x10 2.54mm double row Through.

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