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MKDS-3-8-5.08, 8 pins, pitch 10mm, size 115x9mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311011_RT016xxHBWC_OFF-022771S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 804-302 45Degree pitch 7.5mm size 24.8x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 804-303, 45Degree (cable under 45degree), 4 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST VH series connector, 14110513010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0210, with PCB locator, 8 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 10.16 mm (400 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size (see.

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