3
1
Back

5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row Surface mounted socket strip SMD 2x03 1.27mm double row surface-mounted straight socket strip, 1x04, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x04 1.27mm double row Through hole socket strip SMD 1x08 1.00mm single row Surface mounted socket strip SMD 2x34 1.27mm double row Through hole socket strip SMD 1x24 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length.

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