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Bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header SMD 2x03 2.00mm double row Through hole angled socket strip, 1x38, 2.00mm pitch, double rows Through hole socket strip THT 2x11 2.54mm double row Through hole angled pin header THT 1x18 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x09 2.54mm single row Through hole angled pin header THT 2x07 2.54mm double row Through hole straight socket strip, 2x21.

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