3
1
Back

460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 10.8x6.64mm 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 6-lead though-hole.

New Pull Request