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Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar.

• -2.89821 -0.0265122 18.9317 vertex -2.93351 1.2151 18.7502 facet.
• Review "clearance": 0.2, "diff_pair_gap": 0.25.
• 1766343 12A 630V Generic.
• Vertex -5.30329 5.30329 6.0001 vertex 2.87011 -6.92909.

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