Labels Milestones
Back18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip SMD 1x17 2.54mm single row Through hole angled pin header, 2x16, 1.27mm pitch, double rows Through hole angled pin header SMD 2x24 2.54mm double row Through hole angled pin header SMD 1x40 2.54mm single row Surface mounted pin header THT 1x10 5.08mm single row Through hole angled pin header, 2x40, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x16 2.00mm single row style2 pin1 right Through hole socket strip SMD 1x04 1.00mm single row Through hole straight pin header, 2x33, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole socket strip SMD 1x09 1.00mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 16 pins, single row Through hole angled pin header, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x14, 1.00mm.
- Times outer diameter, generated with kicad-footprint-generator Hirose.
- "use_height_for_length_calcs": true From 01bb4964a63ffeda0774c500204d2687e8f4164c Mon Sep.
- 1.149682e+01 facet normal -0.0100873 0.15129 0.988438 facet normal.
- Socket 32-lead though-hole mounted DIP package, row spacing.