synth_tools

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Right_rib_x = width_mm - hole_dist_side, height - v_margin - title_font_size*2; saw_out = [output_column, bottom_row, 0]; pwm_pot = [input_column + h_margin/2, row_1, 0]; fm_pot = [input_column + h_margin/2, row_1, 0]; audio_out_2 = [right_col, row_1, 0]; pwm_in = [input_column - h_margin/2, bottom_row, 0]; cv_in = [h_margin, row_1, 0]; pwm_in = [input_column + h_margin/2, row_1, 0]; fm_pot = [input_column - h_margin/2, bottom_row, 0]; c_tune = [second_col, fourth_row, 0]; pwm_cv_lvl = [width_mm - h_margin - working_width/8, row_4, 0]; pwm_cv_lvl = [second_col, fifth_row, 0]; square_out = [output_column, row_2, 0]; audio_in_2 = [left_col, row_6, 0]; cv_1b_atten = [right_col, row_7, 0]; manual_1 = [left_col, row_3, 0]; pwm_duty = [second_col, first_row, 0]; c_tune = [second_col, fifth_row, 0]; //left_rib_x = thickness of the PCB, with tolerances // th = thickness + 6 + tolerance; rotate_vector_cos = 0.94; // 'x' of 20 degree rotation rotate_vector_sin = 0.34; // 'y' of rotation left_edge = -rotate_vector_sin * rail_depth; right_edge = height - rail_clearance - thickness*2 - 16.5/2; // 16.5 is the two resistors Properly assign potentiometer pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf.

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