3
1
Back

Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-7, Vertical, RM 1.27mm, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 5.45mm TO-247-3, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-5, Horizontal, RM 2.54mm TO-247-5, Horizontal, RM 2.286mm SIPAK Horizontal RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220-7 Vertical RM 2.54mm staggered type-2 TO-220-9, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.7mm, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, though-hole, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP.

New Pull Request