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ST WLCSP-132, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top.

• Electronics 9774060960 (https://katalog.we-online.de/em/datasheet/9774060960.pdf,), generated.
• -6.18187 19.9 facet normal -5.393483e-002 -9.438588e-002 9.940736e-001.
• -0.0243222 -0.308979 0.950758 vertex 4.20843.
• 0 19.942 facet normal 0.392055 -0.2628.

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