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BackDFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 2x05, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted socket strip THT 1x32 2.00mm single row Through hole angled pin header, 2x30, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x32 2.54mm double row Through hole angled pin header SMD 1x28 1.27mm single row Through hole pin header SMD 1x34 2.00mm single row style2 pin1 right Through hole socket strip SMD 2x10.
- IM Signal Relay DPDT Finder 40.41, Pitch 3.5mm/7.5mm.
- Hardware/Panel/precadsr-panel/precadsr-panel.pro Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-B_SilkS.gbr Normal file.