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5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip, 2x36, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header THT 2x38 1.00mm double row Through hole pin header THT 1x40 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x36 2.54mm double row surface-mounted straight socket strip, 2x13, 2.54mm pitch, double rows Through hole socket strip SMD 2x02 1.00mm double row Through hole angled socket strip SMD 2x33 1.00mm double row Through hole straight.

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