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ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 1156.

• Entryplastic_peg Molex Mini-Fit Jr. Power Connectors, 105309-xx03.
• 0.0747576 7.37473 6.86461 facet normal 0.106825 -0.137635 0.984705.
• Diameter=8mm, Electrolytic Capacitor C.

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