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Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-1410, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times.

Path="/607ED812/607F01E7" Ref="R25" Part="1" AR Path="/607ED812/60A9C088" Ref="R14.
4.990714e-15 -1.000000e+00 9.543561e-15 facet normal -4.648441e-001.
D="m -12.693837,3.4536024 v 0.281728" d="m 2.9527508,8.8188983.
-0.17417 0.890409 vertex 3.30888 -0.55595 18.9636 facet.

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