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27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header THT 1x21 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x03 1.27mm double row surface-mounted straight pin header, 2x15, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x22 2.54mm single row Through hole horizontal IDC box header, 2x32, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header SMD 1x26 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x04 2.00mm single row Through hole angled pin header, 2x03, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header THT 2x24 2.54mm double row Through hole horizontal IDC box header THT 2x38 2.00mm double row Through hole pin header THT 2x25 2.54mm double.

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