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SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip.

Normal 0.135117 -0.297038 0.945258.
Count:** 74 **Component Count.
0.748157 0.309808 0.586754 vertex 2.04556.
504050-0691 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Soldered wire.

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