Labels Milestones
BackConnector, M20-89020xx, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator JST SH series connector, 501331-0707 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC_7351.
- Size 45x7.6mm^2, drill diamater 1.3mm, pad.
- HLE-118-02-xxx-DV-BE-LC, 18 Pins per row.
- BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA.