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YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/6-V-7.5-ZB 1719354 Connector Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.81; number of pins: 16; pin pitch: 7.62mm; Vertical || order number: 1827949 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/8-G-3.81; number of pins: 09; pin pitch: 5.08mm; Angled || order number: 1836299 8A 320V Generic Phoenix.

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