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Integration Y Package SIPAK, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 5.08mm TO-220F-2, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-5, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 10.95mm SOT-93 TO-218-2, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-5, Horizontal, RM 2.54mm, staggered type-2 TO-220-9 Horizontal RM 1.27mm staggered type-2 TO-220F-15, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 1.27mm staggered type-1 TO-220-9 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-5, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-15, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas.

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