Labels Milestones
BackHand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Molded Wide transistor TO-92L leads in-line (large body variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 11.48 mm.
- Body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf), generated.
- Segment orange, common anode, https://docs.broadcom.com/docs/AV02-2553EN One digit.