3
1
Back

Force socket, through-hole, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-11, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 5.08mm TO-220-2, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-4 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 5.08mm TO-126-3.

New Pull Request