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Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x18 2.54mm single row Surface mounted pin header SMD 1x37 2.54mm single row style2 pin1 right Through hole straight pin header, 1x40, 2.00mm pitch, single row Through hole socket strip THT 1x24 1.00mm single row Surface mounted socket strip THT 1x28 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x15, 1.27mm pitch, double rows Through hole angled pin header, 1x21, 1.00mm pitch, single row Through hole angled pin header, 1x09, 1.00mm pitch, single row Through hole straight pin header, 1x21, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x38 2.00mm single row (from.

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