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Horizontal RM 1.7mm staggered type-1 TO-220-7 Horizontal RM 1.7mm staggered type-1 TO-220-4 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220-4 Vertical RM 5.45mm TO-3P-3, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.7mm staggered type-2 TO-220-4 Vertical RM 1.7mm staggered type-2 TO-220-9, Horizontal, RM 2.286mm SIPAK Horizontal RM 5.08mm TO-126-3, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.8mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x08, 2.54mm pitch, double rows Surface mounted pin header THT 2x31 1.00mm double row surface-mounted straight pin header, 1x35, 1.00mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x35 1.00mm single row Through hole socket strip SMD 1x28 2.00mm single row style2 pin1 right Through hole angled pin header, 2x39, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC box header THT 1x05 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x21 1.00mm single row Surface mounted pin header SMD 2x12 1.27mm double row Through hole vertical IDC box header THT 2x32 2.00mm double row surface-mounted straight socket strip, 2x13.

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