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225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 1.27mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.54mm TO-220-4, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.54mm staggered type-2 TO-220F-15 Vertical RM 1.27mm staggered type-1 TO-220F-9, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 5.45mm TO-3P-3, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.7mm staggered type-1 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 2.54mm, staggered type-2 TO-220-4 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 1.7mm staggered type-1 TO-220F-4, Vertical, RM 2.54mm, staggered type-1 TO-220-11, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-11, Vertical, RM 1.27mm, staggered type-2 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 2.54mm TO-220-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 12-lead.

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