Labels Milestones
BackDouble Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 7.62mm 300mil 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 8.61 mm (338 mils), body size.
- Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15.
- Explainer https://drive.google.com/drive/folders/156nn9rClRLJplS4M46s56-Pibi86Z-Kp for schematics.