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(https://www.sitime.com/datasheet/SiT9365 page 13 SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 2.2mm, M2 mounting hole 8.4mm m8 Mounting Hardware, inside through hole M3, height 2.6, Wuerth electronics 9774110360 (https://katalog.we-online.de/em/datasheet/9774110360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 50 Pin (JEDEC MO-153 Var AD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex PicoBlade series connector, 53261-0971 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box header 2x07 2.54mm double row surface-mounted straight pin header, 2x14, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x26 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x30, 1.00mm pitch, 2.0mm pin length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole pin header THT 2x22 1.27mm double row surface-mounted straight socket strip, 1x09, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x23 2.00mm double row Through hole angled socket strip, 2x07, 2.54mm pitch, double cols.

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