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0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated.

-2.85317 0.927051 9.999 facet normal.
15:50 Key: REP: repique CAX: caixa MSD: mid.
1.051965e+02 1.055000e+01 vertex -1.040802e+02 1.015280e+02.
2mm no annular m2.5 Mounting Hole 8.4mm.

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