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Number: A-41791-0005 example for new part number: A-41791-0015 example for new mpn: 39-30-0220, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 502382-1470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 10 Pin (https://fscdn.rohm.com/en/techdata_basic/ic/package/Jisso_MLGA010V020A-1-2_Rev005s_E2(MSL3).pdf ST HLGA, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-62XX, 6 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 8 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220-7, Horizontal, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 10.9mm TO-264-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST 1P1T CK components KMR2 tactile switch D MEC 5G single pole normally-open illuminated tactile switch SPST angled PTS645VL31-2 LFS C&K Button SW PUSH SMALL Tactile C&K Generic Buzzer, D12mm height 9.5mm with RM7.6mm Generic Buzzer, D14mm height 7mm Non-Polar Electrolytic Capacitor CP, Radial series, Radial, pin pitch=7.50mm, , length*width=9*6.7mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.08mm size 61x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-3-16-5.08 pitch 5.08mm length 12.8mm diameter 5.8mm Fastron HBCC Inductor, Axial series, Axial, Horizontal, pin pitch=7.62mm, , length*diameter=5.3*2.2mm^2, Vishay, IM-1, http://www.vishay.com/docs/34030/im.pdf Inductor Axial series Axial Horizontal pin pitch 7.50mm diameter 13mm Electrolytic Capacitor CP, Radial series, Radial, pin pitch=27.50mm, , length*width=31.5*15mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect.

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