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B3B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector Molex Pico-Clasp series connector, B5P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB cutout, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP.

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