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SOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-15P-1.25DS, 15 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator JST PH series connector, 505405-0870 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: GMSTBV_2,5/6-GF-7,62; number of pins: 06; pin pitch: 3.50mm; Vertical.

3.1141734,8.5472427 h 0.622047 v 0.6220475 h -0.456693 -0.165354,-0.1574803.
-9.415584e-001 -3.760120e-003 3.368289e-001 vertex 5.043358e+000 2.888088e+000.
2.414 (end 2.171 2.414 (end.
0.996913 -0.0703629 vertex -8.05435.

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