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Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad 3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11.

• // Whether to create a serrating effect.
• Mm vertical board mount module ACDC-Converter.

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