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(375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing.

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