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HLE-136-02-xxx-DV-BE, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, DF52-8S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081703_C_DC6.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-LC, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV-BE, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105313-xx06, 6 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105313-xx08, 8 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.75 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xxx-DV-BE-LC, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, Linx (https://linxtechnologies.com/wp/wp-content/uploads/rxm-gps-rm.pdf Quectel L80-R GPS Module, Patch on Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf QFN-24, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification QFN-20, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification QFN-20, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification ublox LEA 6/7/8, (https://www.u-blox.com/sites/default/files/LEA-M8S-M8T-FW3_HardwareIntegrationManual_%28UBX-15030060%29.pdf GPS ublox LEA 6/7/8, (https://www.u-blox.com/sites/default/files/LEA-M8S-M8T-FW3_HardwareIntegrationManual_%28UBX-15030060%29.pdf GPS ublox LEA 6/7/8, (https://www.u-blox.com/sites/default/files/LEA-M8S-M8T-FW3_HardwareIntegrationManual_%28UBX-15030060%29.pdf GPS ublox NEO 6/7/8 GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf.

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